Snowcap's PCL logic is clocked and powered by microwave energy. That energy has to be generated, conditioned, and carried from room temperature down through every thermal stage to a chip sitting at 4.2 Kelvin. It has to arrive clean, matched, and without dragging a thermal load into the cold stage that the cryogenic plant cannot absorb. The RF power delivery network is the structure that makes that possible. This role builds it.
You will own the RF PDN end to end: system architecture and budget, on-chip and off-chip circuit design, EM and circuit simulation, tapeout of dedicated RF PDN validation vehicles, and integration of PDN structures into product chip tapeouts. You will define what "correct" means for the PDN: the specs, the verification plan, the measurement protocol. Then you will prove it on real silicon in our own cryogenic lab. You will work directly with the physics team, the design and EDA group, the fab technology team, and the test organization in a flat, matrixed structure. There are no layers between you and the problem.
In twelve months, the PDN architecture you set should be the one every subsequent chip generation inherits, the simulation-to-measurement correlation on it should be tight enough that the design team trusts the model, and the PDN should be a first-class object in the automated EDA flow rather than something bolted on at the end. This is a founding-level technical seat in an area where we have no incumbent methodology.